6.777J/2.751J Material Property Database

 

Material:  SU-8 Photoresist

 

Property

Value

Reference

Image/URL (optional)

Mass density

1,190 kg/m3

Roch, I., “Fabrication and characterization of an SU-8 gripper actuated by a shape memory alloy thin film”. Institute of Physics, Vol. 13, Issue 2, pg. 330, 2003

 

Young's modulus

4.02 Gpa

http://aveclafaux.freeservers.com/SU-8.html

 

Poisson ratio

0.22

http://aveclafaux.freeservers.com/SU-8.html

 

Stiffness Constants

 

 

 

Tensile or fracture strength

34 Mpa

http://aveclafaux.freeservers.com/SU-8.html

 

Residual stress on silicon

16-19 MPa

http://aveclafaux.freeservers.com/SU-8.html

 

Specific heat

 

 

 

Thermal conductivity

0.2 W/mK

http://aveclafaux.freeservers.com/SU-8.html

 

Dielectric constant

3

http://aveclafaux.freeservers.com/SU-8.html

 

Index of refraction

1.67-1.8

http://aveclafaux.freeservers.com/SU-8.html

 

Electrical conductivity

 

 

 

Magnetic permeability

1.08

Calculated from n = (ermr)1/2 for linear media

 

Piezoresistivity

 

 

 

Piezoelectricity

 

 

 

Wet etching method

PGMEA

Normal chemical for developing SU-8

 

Plasma etching method

FIB (?)

Focused Ion Beam can be used to cut SU-8 (dry etch)

 

Adhesion to silicon dioxide

Poor

Conradie, E.H., “SU-8 thick photoresist processing as a functional material for MEMS applications”. Institute of Physics, Vol. 12, Issue 4, pg. 368, 2002

 

Biocompatibility

Good

http://aveclafaux.freeservers.com/SU-8.html

 

Hydrophobicity

Hydrophobic

http://aveclafaux.freeservers.com/SU-8.html

(used for fluidic channels)