6.777J/2.751J Material Property
Database
Material: PDMS (polydimethylsiloxane)
| 
   Property  | 
  
   Value  | 
  
   Reference  | 
  
   Image/URL (optional)  | 
 
| 
   
  | 
  
   0.97 kg/m3  | 
  
   Polymer
  Data Handbook, Mark J.,   | 
  
   | 
 
| 
   Young's
  modulus  | 
  
   360-870
  KPa  | 
  
   Re-configurable
  Fluid Circuits by PDMS Elastomer Micromachining  | 
  
   http://mass.micro.uiuc.edu/ publications/papers/26.pdf  | 
 
| 
   Poisson
  ratio  | 
  
   0.5  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Stiffness
  Constants  | 
  
   | 
  
   | 
  
   | 
 
| 
   Tensile
  or fracture strength  | 
  
   2.24 MPa  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Residual
  stress on silicon  | 
  
   | 
  
   | 
  
   | 
 
| 
   Specific
  heat  | 
  
    1.46 kJ/kg K  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Thermal
  conductivity  | 
  
   0.15
  W/m K  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Dielectric
  constant  | 
  
   2.3-2.8  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Index
  of refraction  | 
  
   1.4  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Electrical
  conductivity  | 
  
   4x1013
  Ωm  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Magnetic
  permeability  | 
  
   0.6x106
  cm3/g  | 
  
   Polymer
  Data Handbook  | 
  
   | 
 
| 
   Piezoresistivity  | 
  
   N/A  | 
  
   | 
  
   | 
 
| 
   Piezoelectricity  | 
  
   N/A  | 
  
   | 
  
   | 
 
| 
   Wet
  etching method  | 
  
   tetrabutylammonium fluoride (C16H36FN) + n-methyl-2-pyrrolidinone
  (C5H9NO)  3:1  | 
  
   J. Garra, T. Long, J. Currie, T. Schneider, R. White, M. Paranjape, “Dry Etching of Polydimethylsiloxane for Microfluidic Systems”,
  Journal of  | 
  
   http://scitation.aip.org/journals/doc/JVTAD6-ft/vol_20/iss_3/975_1.html  | 
 
| 
   Plasma
  etching method  | 
  
   CF4+O2  | 
  
   J. Garra, T. Long, J. Currie, T. Schneider, R. White, M. Paranjape, “Dry Etching of Polydimethylsiloxane for Microfluidic Systems”,
  Journal of Vacuum Science and Technology, A20, pp 975-982,
  2002.  | 
  
   http://scitation.aip.org/journals/doc/JVTAD6-ft/vol_20/iss_3/975_1.html  | 
 
| 
   Adhesion
  to silicon dioxide  | 
  
   Excellent  | 
  
   Re-configurable
  Fluid Circuits by PDMS Elastomer Micromachining  | 
  
   http://mass.micro.uiuc.edu/ publications/papers/26.pdf  | 
 
| 
   Biocompatibility  | 
  
   Noniritating to skin, no adverse effect on rabbits and mice, only
  mild inflammatory reaction when implanted  | 
  
   Polymer
  Data Handbook; Belanger
  MC, Marois Y. Hemocompatibility,
  biocompatibility, inflammatory
  and in vivo studies of primary reference materials low-density polyethylene and polydimethylsiloxane:
  a review. J Biomed Mater Res 2001;58(5):467–77.  | 
  
   | 
 
| 
   Hydrophobicity  | 
  
   Highly
  hydrophobic, contact angle 90-120°  | 
  
   Re-configurable
  Fluid Circuits by PDMS Elastomer Micromachining  | 
  
   http://mass.micro.uiuc.edu/ publications/papers/26.pdf  | 
 
| 
   Melting
  Point  | 
  
   -49.9–40°  | 
  
   Knovel Critical Tables  | 
  
   | 
 
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