6.777J/2.751J Material Property Database

 

Material:  Gold (PVD or electroplated)

 

 

Property

Value

Reference

Image/URL (optional)

Mass density

19280 kg/m^3
(bulk)

CRC Materials Science and Engineering Handbook, p.48

 

Young's modulus

35~44 GPa
(error +-5Gpa) (Electroplated)

Baek,C.W. “Mechanical Property Measurment of electroplated gold microstructure using resonance method”, Microelectromechanical System Device 2, vol605,pp229-234

 

Poisson ratio

0.44

 

http://www.webelements.com/webelements/elements/text/Au/phys.html

Stiffness Constants

N/A

N/A

N/A

Tensile or fracture strength

127Mpa(tensile) (Electroplated)

Material Handbook
(Science Library)

 

Residual stress on silicon

67~74MPa (tensile)

Baek,C.W. “Mechanical Property Measurment of electroplated gold microstructure using resonance method”, Microelectromechanical System Device 2, vol605,pp229-234

 

Specific heat

128.74 J/kg/K at Temp=25 C (bulk)

CRC Materials Science and Engineering Handbook, p.260

 

Thermal conductivity

315 W/m/K at Temp=300 K

(bulk)

CRC Materials Science and Engineering Handbook, p.270-274

 

Dielectric constant

6.9

Separation of the contribution of free and bound electrons into real and imaginary parts of the dielectric constant of gold.     Shklyarevskii, I. N.; Pakhmov, P. L.    USSR.    Optika i Spektroskopiya  (1973),  34(1),  163-6.

 

Index of refraction

n = 0.467 + 2.415i,
at λ = 532 nm

E. D. Palik, Handbook of Optical Constants of Solids, (Academic, San Diego, 1985)

 

Electrical conductivity

73.4% IACS(20℃)

Material Handbook
(Science Library)

Cf) Electrical Receptivity: 2.35uΩ㎝

Magnetic permeability

1.256*10^-6Tm/A

 

µ=µ0*(1+Xm)

µ0=4π*10^-7Tm/A

Xm = -3.4*10^-5

Piezoresistivity

0.0222Ωmm2/m

 

 

Piezoelectricity

 

 

 

Wet etching method

KI+I2

Campbell, “The science and engineering of microelectronic fabrication”

 

Plasma etching method

C2Cl2F4,Cl2, CClF3

Campbell, “The science and engineering of microelectronic fabrication”

 

Adhesion to silicon dioxide

 

 

 

Biocompatibility

Good

 

 

Hydrophobicity

Contact angle with water: 0

M.Schneegans and E. Menzel, J. Colloid Interface Sci, 88(1982) 97