6.777J/2.751J Material Property Database

 

Material:  Aluminum Oxide

 

Property

Value

Reference

Image/URL (optional)

Mass density

3960 kg/m^3

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

Young's modulus

370 Gpa

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

Poisson ratio

0.2

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

Stiffness Constants

Not found

 

 

Tensile or fracture strength

300 MPa

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

Residual stress on silicon

Not found

 

 

Specific heat

850 J/(kgK)

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

 

Thermal conductivity

30 W/(mK)

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

 

Dielectric constant

9.9

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

 

Index of refraction

1.76

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

 

Electrical conductivity

1e-14 /ohm/cm

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

 

Magnetic permeability

Susceptibility k=-3.7e-5  m^3/mol

m=1+4pk

E.W.Lee, “Magnetism: an Introductory Survey”

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

Piezoresistivity

N/A

 

 

Piezoelectricity

Not found

 

 

Wet etching method

Ar+ bombardment then H3PO4 etch

 


http://www.lamel.bo.cnr.it/pub/abstract/Bianconi2.html

Plasma etching method

Not found

 

 

Adhesion to silicon dioxide

Not found

 

 

Biocompatibility

Yes

 

http://faculty.virginia.edu/Nanoscale_Laser_Processing/Apl%20and%20PDFs/SrS-Te%20Frost%20Blurb%202003.htm

Hydrophobicity

Not found

 

 

Melting Point

2054 C

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

 

CTE

7.4e-6 /K

Matweb.com

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A