6.777J/2.751J Material Property Database

 

Material: Tungsten

 

Property

Value

Reference

Image/URL (optional)

Mass density

19.25 g/cm3

MEMSnet

http://www.memsnet.org/material/tungstenwbulk/

 

Young's modulus

410 Gpa

MEMSnet

http://www.memsnet.org/material/tungstenwfilm/

 

Poisson ratio

0.26

Applied Physics Letters, Vol 73, No 14

“Poisson’s ratio measurement in tungsten thin films combining an x-ray diffractometer with in situ tensile tester”

 

Stiffness Constants

 

 

 

Tensile or fracture strength

0.01

Limiting Strain – MEMSnet

http://www.memsnet.org/material/tungstenwfilm/

 

Residual stress on silicon

-3 – 2 Gpa

Journal of Applied Physics, Vol 87, No 1

“Residual stress, microstructure, and structure of tungsten thin films deposited by magnetron sputtering”

 

Specific heat

132.51 J/kg/K

MEMSnet

http://www.memsnet.org/material/tungstenwbulk/

 

Thermal conductivity

178 W/m/K

MEMSnet

http://www.memsnet.org/material/tungstenwbulk/

 

Dielectric constant

 

 

 

Index of refraction

 

 

 

Electrical conductivity

5.3 x 10-6 W cm

Tungsten and Other Refractory Metals for VLSI Applications, 1985 – “Tungeten – A Spectator’s View”

 

Magnetic permeability

3.3 x 10-7

MatWeb

http://www.matweb.com/search/SpecificMaterial.asp?bassnum=MEW000

 

Piezoresistivity

 

 

 

Piezoelectricity

 

 

 

Wet etching method

Acids

 

 

Plasma etching method

SF6

Acta Polytechnica Scandinavica, Electrical Engineering Series, 1995

“Plasma etching in microdevice fabrication: thin film and process integration aspects”

 

Adhesion to silicon dioxide

Low to none

Tungsten and Other Refractory Metals for VLSI Applications, 1985

“Adhesion of non-selective CVD tungsten to silicon dioxide”

 

Biocompatibility

 

 

 

Hydrophobicity