6.777J/2.751J Material Property Database

 

Material: Thermal silicon oxide

 

Property

Value

Reference

Image/URL (optional)

Mass density

2200 kg/m^3

IEEE Transactions on electron devices,Vol.ED25,No.10,Oct1978, p.1249

here

Young's modulus

70(wet grown) 57(dry grown)

Thin Solid Films,283(1996), p.15,

IEEE Transactions on electron devices,Vol.ED25,No.10,Oct1978, p.1249

here

Poisson ratio

0.17

Thin Solid Films,283(1996), p.15

here

Stiffness Constants

Since films are amorphous, see Young’s modulus

 

 

Tensile or fracture strength

110 MPa (tensile strength), 690-1380 MPa (compressive strength)

AZOM

 

Residual stress on silicon

-300 MPa (biaxial), -275 to -225 MPa (wet 950 deg C)

MEMS Clearinghouse, IEEE MEMS Workshop, p.223, 1993

 

Specific heat

1.0 J/gK

A.S. Grove: Physics and Technology of Semiconductor Devices

 

Thermal conductivity

1.4 W/mK

A.S. Grove: Physics and Technology of Semiconductor Devices

 

Dielectric constant

3.9

Muller and Kamins: Device Electronics for Integrated Circuits

 

Index of refraction

1.46

Michelle M. Gauthier, Engineering Materials Handbook, ASM desk edition. Materials Park, OH, Nov 1995.

 

Electrical conductivity

Insulator, 10^-12 S/cm

Michelle M. Gauthier, Engineering Materials Handbook,

 

Magnetic permeability

Must be small, most probably zero, because amorphous

 

 

Piezoresistivity

No, since amorphous

 

 

Piezoelectricity

No, amorphous

 

 

Wet etching method

Buffered HF

Steve Senturia’s book

 

Plasma etching method

CF4/H2

Steve Senturia’s book

 

Adhesion to silicon dioxide

Hm… very adhesive J

 

 

Biocompatibility

Compatible (a piece of glass in a tissue will probably not cause repelling)

 

 

Hydrophobicity

Hydrophilic, but not too much (drop some water on a glass)