6.777J/2.751J Material Property Database

 

Material: Polyimide

 

Property

Value

Reference

Image/URL (optional)

Mass density

1.42 g/cc

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Young's modulus

2.5 GPa

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Poisson ratio

0.34 @ 23°C

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Stiffness Constants

(if crystalline)

 

 

 

Tensile strength

231 MPa @ 23°C

139 MPa @ 200°C

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Residual stress on silicon

35MPa @5 μm , on 8” wafer, 375°C cure

Photodefinable HD-4000 Series Polyimide Product Bulletin.”  http://www.hdmicrosystems.com

 

Specific heat

1.09 J/(g*K)

0.261 cal/(g*°C)

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Thermal conductivity

0.12 W/(mK)

2.87e-4 cal/(cm*sec*°C)

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Dielectric constant

3.4 @ 25 μm, 1kHz

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Index of refraction

1.70

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Electrical conductivity

1.5e17 Ωcm

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf

 

Magnetic permeability

 

 

 

Piezoresistivity (if a  conductor)

 

 

 

Piezoelectricity

coefficient

3.8e-12c/N (in abstract)

3.8e-3c/N in table in body of paper

Tong, Yuejin, et. al.  “Preparation and properties of polyimide films codoped with barium and titanium oxides.”
 Journal of Applied Polymer Science, v 83, n 8,
22 Feb. 2002, p 1810-16.

 

Wet etching method

TMAH developer can be used to develop exposed photoresist and etch unmasked underlying polyimide in one step.

“Product Bulletin PI-2545 Wet Etch Polyimide.”  http://www.hdmicrosystems.com

 

Plasma etching method

Use PECVD silicon nitride mask and use O2 plasma etch, possibly with CF4

Lee, Y.K. et al.  “Reactive Ion Etich of the Fluorinated Polyimide Film.”  Advanced Metallization for Future ULSI.  Symposium, 1996, p 455-61.  Abstract.

 

Adhesion to silicon dioxide

Varies; “A separate adhesion promoter is recommended with PI-2525, PI-2555, PI-2556 to promote adhesion to oxides and metals.  PI-2575 is self priming and does not require an adhesion promoter.”

“Product Information Pyralin PI2525, PI2555, PI-2575 & PI2556.”  http://www.hdmicrosystems.com

 

Biocompatibility

Used in Bio-MEMS an implantable intracortical electrode array. “Polyimide also provides an ideal surface for the selective attachment of various important bioactive species onto the device in order to encourage favorable long-term reactions at the tissue-electrode interface.  “Overall polyimide is a proven  biocompatible material and an excellent choice for neuroprosthetic applications.”


Rousche, P.J.; Pellinen, D.S.; Pivin, D.P., Jr.; Williams, J.C.; Vetter, R.J.; kirke, D.R.. “Flexible polyimide-based intracortical electrode arrays with bioactive capability.”
Biomedical Engineering, IEEE Transactions on  ,Volume: 48 , Issue: 3 , March 2001
Pages:361 - 371

Can be found using IEEE Xplore

Hydrophobicity

82 degrees

Ghosh, I. et al.  “Surfaces Properties of Chemically Modified Polyimide Films.”  Journal of Adhesion Science and Technology.  Vol 11.  no.6.  1997. Abstract. 

 

Melting point

Does not melt,

Decomposes at 520°C

“Dupont Kapton Polyimide Film General Specifications, Bulletin GS-96-7”.  http://www.dupont.com/kapton/general/H-38479-4.pdf