| 
     Property 
     | 
    
     Value 
     | 
    
     Reference 
     | 
    
     Image/URL (optional) 
     | 
   
   
    | 
      Mass density 
     | 
    
     1170-1200MPa 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Young's
    modulus 
     | 
    
     1800-3100 MPa 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Poisson
    ratio 
     | 
    
     0.35-0.4 
     | 
    
     http://www.goodfellow.com/csp/active/static/A/ME30.HTML 
     | 
    
       
     | 
   
   
    | 
     Stiffness
    Constants 
     | 
    
     2944MPa (modulus of elasticity) 
     | 
    
     http://www.tstar.com/Materials/ShowDetail.asp?Menu=&Type_ID=497 
     | 
    
       
     | 
   
   
    | 
     Tensile or
    fracture strength 
     | 
    
     48-76 MPa 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Residual
    stress on silicon 
     | 
    
       
     | 
    
       
     | 
    
       
     | 
   
   
    | 
     Specific
    heat 
     | 
    
     1466 J/kg/K 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Thermal
    conductivity 
     | 
    
     0.167-0.25 W/m.K 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Dielectric
    constant 
     | 
    
     2.6 at 1MHz 
     | 
    
     http://www.goodfellow.com/csp/active/static/A/ME30.HTML 
     | 
    
       
     | 
   
   
    | 
     Index of
    refraction 
     | 
    
     1.492 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Electrical
    conductivity 
     | 
    
     1E-19 (inverse of resistivity) 
     | 
    
     http://www.io.tudelft.nl/research/dfs/idemat/Onl_db/Id123p.htm 
     | 
    
       
     | 
   
   
    | 
     Magnetic
    permeability 
     | 
    
       
     | 
    
       
     | 
    
       
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    | 
     Piezoresistivity 
     | 
    
       
     | 
    
       
     | 
    
       
     | 
   
   
    | 
     Piezoelectricity 
     | 
    
       
     | 
    
       
     | 
    
       
     | 
   
   
    | 
     Wet etching
    method 
     | 
    
     Possible using any chemical
    that can degrade PMMA 
    Examples: aldehydes,
    ether, ammonia, acetone 
     | 
    
     See complete list on http://www.bohlender.de/e/x.pdf 
     | 
    
       
     | 
   
   
    | 
     Plasma
    etching method 
     | 
    
     OK with O2 
     | 
    
     M. J. Madou, Fundamentals
    of Microfabrication, 2000   
     | 
    
       
     | 
   
   
    | 
     Adhesion to
    silicon dioxide 
     | 
    
     Yes possible: PMMA is often
    used as a mask. Use 0.8% of BPO(benzoyl peroxide)
    to improve adhesion 
     | 
    
     M. J. Madou, Fundamentals
    of Microfabrication, 2000   
     | 
    
       
     | 
   
   
    | 
     Biocompatibility 
     | 
    
     Yes: used for diverse
    biomaterials: bone cement, dializer, scaffolds
    for tissue engineering, etc. 
     | 
    
     http://www.annanurse.org/resource/corpmem/toray.htm 
     | 
    
       
     | 
   
   
    | 
     Hydrophobicity 
     | 
    
     Pretty hydrophobic: contact
    angle = 72degres 
     | 
    
     http://www.micromemanalytical.com/CAngle/ConAngl.htm 
     | 
    
       
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