6.777J/2.751J Material Property Database


Material: Aluminum (incl. alloys w/ Si or Si+Cu)





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Mass density

2700 kg/m^3

CRC Materials Science and Engineering Handbook, p.46


Young's modulus

70 GPa

Thin Solid Films,270(1995), p.263


Poisson ratio


Microprobe-type measurement of Young's modulus and Poisson coefficient by means of depth sensing indentation and acoustic microscopy, Comte, C. von Stebut, J. Surface & Coatings Technology, v 154, n 1, 1 May 2002, p 42-8


Stiffness Constants




Tensile or fracture strength

Pure aluminum: 47 MPa

Film in the article: 70 MPa

Aluminum deposition by using MOCVD on pitch based carbon fibers, Suzuki, T., Materials Science and Engineering Serving Society. Proceedings of the Third Okinaga Symposium on Materials Science and Engineering Serving Society, 1998, p 210-13


Residual stress on silicon

-20 to -30 MPa unannealed 120 to 140 MPa annealed at 450C

X-ray determination of the residual stresses in thin aluminum films deposited on silicon substrates, Korhonen, M.A., Paszkiet, C.A., Scripta Metallurgica, v 23, n 8, Aug. 1989, p 1449-53


Specific heat

898.7 J/kg/K

CRC Materials Science and Engineering Handbook, p.260


Thermal conductivity

237 W/m/K

CRC Materials Science and Engineering Handbook, p.270-274


Dielectric constant

Aluminum powder 1.6-1.8

Dielectric Constant Reference Guide


Index of refraction


Chemical Properties Handbook
Edited by Yaws, C.L. 1999; McGraw-Hill


Electrical conductivity

3.538x107 S/m

Nondestructive Testing Resource Center


Magnetic permeability


Susceptibility =  6x10-7 cgs

Basic analysis of a metal detector Yamazaki, S.; Nakane, H.; Tanaka, A., IEEE Transactions on Instrumentation and Measurement, Volume: 51,   Issue: 4,   Year: Aug 2002, Page(s): 810- 814

Susceptibility from http://www.matweb.com/search/SpecificMaterial.asp?bassnum=MEAl00


2x10-5 Ohm-cm

Determination of the coefficient of piezoresistivity in aluminum alloy interconnect structures
Reilly, C.J., Sanchez, J.E., Jr,  Materials Reliability in Microelectronics IX. Symposium, 1999, p 213-18






Wet etching method

85 wt.% phosphoric acid solution

Wet etching mechanisms of aluminum electrodes under the low pressure-linewidth narrowing phenomena
Uchiyama, M.; Nakamura, M. Denki Kagaku, v 56, n 7, July 1988, p 563-8


Plasma etching method

Cl2, BCl3/Cl2

Langmuir probe studies of a transformer-coupled plasma, aluminum etcher
Malyshev, M.V.; Donnelly, V.M.; Kornblit, A.; Ciampa, N.A.; Colonell, J.I.; Lee, J.T.C. Source: Journal of Vacuum Science & Technology A (Vacuum, Surfaces, and Films), v 17, n 2, March 1999, p 480-92


Adhesion to silicon dioxide


The reaction of Al with vitreous silica
Black, J.R., 15th Annual Proceedings Reliability Physics, 1977, p 257-61




Dependence of in vitro biocompatibility of ionomeric cements on ion release, A. J. Devlin,
Journal of Materials Science: Materials in Medicine 9(12): 737-741; Dec 1998

Medical Device Link - MDDI July 2002 Metalworking: Making the Cuts of Tomorrow, Today Medical device...
URL: http://www.devicelink.com:80/mddi/archive/02/07/001.html


90 degrees below 120C

Contact angle temperature dependence for water droplets on practical aluminum surfaces
Bernardin, J.D.; Mudawar, I.; Walsh, C.B.; Franses, E.I.International Journal of Heat and Mass Transfer, v 40, n 5, March 1997, p 1017-33